Party leader attends groundbreaking of high-tech semiconductor manufacturing plant
VOV.VN - Party General Secretary To Lam who is also Secretary of the Central Military Commission and Head of the Central Steering Committee for science and technology development, innovation and digital transformation attended a groundbreaking ceremony for a high-tech semiconductor manufacturing plant invested by Viettel Group on January 16 at the Hoa Lac Hi-Tech Park in Hanoi.
Prime Minister Pham Minh Chinh also joined the event.
The plant, covering 27 hectares at the Hoa Lac Hi-Tech Park, is designed to serve as national infrastructure for semiconductor research, design, testing and manufacturing. Once operational, it is expected to support key industries including telecommunications, aerospace, automotive manufacturing, medical equipment, automation and the Internet of Things (IoT).
The project marks a major step toward completing Vietnam’s domestic semiconductor production chain. Vietnam participates in most stages of the value chain, but chip fabrication, the most complex and critical stage, has yet to be done domestically.
Speaking at the ceremony, Lieutenant General Tao Duc Thang, Chairman and CEO of Viettel Group, said the project would be launched immediately after the groundbreaking. By the end of 2027, Viettel aims to finalize construction, receive technology transfer and begin pilot production.
During the 2028-2030 period, the focus will be on refining processes and improving production efficiency, thereby providing a basis for research into more advanced chip fabrication technologies.
In his remarks, PM Pham Minh Chinh stressed that the groundbreaking of Vietnam’s first high-tech semiconductor manufacturing plant marks a strategic milestone, showing the country’s determination to participate more deeply and substantively in the global semiconductor value chain. The project is in line with Vietnam’s Semiconductor Industry Development Strategy through 2030, with a vision toward 2050.
Chinh noted that after years of implementation, Vietnam’s semiconductor industry has recorded initial results, including the emergence of chip design firms, the development of packaging and testing capabilities, and the formation of a core workforce. However, chip fabrication capacity has remained a key gap, which this project is expected to help deal with.
To ensure effective implementation, he called on ministries, agencies and localities to work closely together to maintain progress, quality and compliance with the law. He also emphasized the need to develop human resources, improve institutions and strengthen linkages between domestic enterprises and the FDI sector, enabling deeper participation in global supply chains.
The high-tech semiconductor manufacturing plant at Hoa Lac is expected to contribute to Vietnam’s capacity to master core technologies, enhance national capacity and lay a solid foundation for the sustainable development of the country’s semiconductor industry in the years ahead.
At the ceremony, Party General Secretary To Lam, Prime Minister Pham Minh Chinh and other leaders carried out the official groundbreaking for the project.