Samsung to pour further US$850 mln in Vietnamese subsidiary
VOV.VN - Electronics giant Samsung of the Republic of Korea’s recent board meeting has adopted the spending of around US$ 850 million for its unit in Vietnam to manufacture flip-chip ball grid arrays (FC-BGA), KBS News recently reported.
FC-BGA is a highly-integrated package board used to connect a high-integration semiconductor chip to a main board.
The investment will be spent in different phases until 2023 in order to build the new FC-BGA production line.
Under the plan, the Vietnamese subsidiary will concentrate on producing FC-BGA, while Samsung's factories in Suwon City (Gyeonggi) and Busan City will specialise in technology development and high-end products.
Samsung is currently the leading enterprise in manufacturing flip-chip ball grid arrays for system semiconductor chips (without memory feature) in mobile phones.